-      Total solution provider

       (Equipment - Material - Process)

-      Roadmap compatible

       (Process flow does not change with thinner wafers)

-      Most versatile and modular technology platform

EVG's temporary bonding / debonding technology enables

thin wafer processing within existing fab and with existing equipment


Allows usage of wafer fab equipment for backside processing (Wafer-level processing)

EVG®850 Debonder
(Please click image to view detailed version)
Thin Wafer Processing
EV Group







For 3D Interconnect  |  TSV Power Devices  |  Compound Semiconductor  |  Packaging | MEMS  |  Temporary Bonding and Debonding Technology 

For more information please contact:  ThinWafer@EVGroup.com
You would like to enlarge your profit?

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through its flexible manufacturing model, EVG develops reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customer's fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment.


There are no limits; only limiting thoughts
Innovation is dedication and superior competence
Reliability is the demand. Consistently high, trustworthy
performance is our response

Triple i - the key to your success

Solutions for the semiconductor and related microelectronics industries.