Thin Wafer Processing
EV Group

 

 

 

 

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Increased demand for applications based on thin wafers and thin microeletronic substrates result also in the need of processing and handling of thin and ultra thin substrates during the manufacturing steps. Thin substrates in the area of IC manufacturing (like memory, CMOS or ChipCard applications), power devices (e.g. IGBT's), compound semiconductors (e.g. for high brightness LED's or RF power amplifiers) as well as emerging technologies that also involve thin or flexible substrates (MEMS; RF-ID-Tags, flexible displays, etc.) require reliable handling and support techniques in order to ensure safe processing.

1. Enabling utilization of existing manufacturing line

2. Rigid carrier technology

3. Enabling 3D stacking and TSV technology

Benefits

For 3D Interconnect  |  TSV Power Devices  |  Compound Semiconductor  |  Packaging | MEMS  |  Temporary Bonding and Debonding Technology 

For more information please contact:  ThinWafer@EVGroup.com
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EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through its flexible manufacturing model, EVG develops reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customer's fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment.

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