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- Total solution provider
(Equipment - Material - Process)
- Roadmap compatible
(Process flow does not change with
thinner wafers)
- Most versatile and modular technology
platform |
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EVG's temporary bonding / debonding technology enables
thin wafer processing within existing fab and with existing
equipment
Allows usage of wafer fab equipment for backside processing (Wafer-level
processing) |
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(Please click image to view detailed version) |
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© EV Group, ALL RIGHTS RESERVED |
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For 3D Interconnect | TSV Power Devices |
Compound Semiconductor | Packaging | MEMS |
Temporary Bonding and Debonding Technology
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You would like to enlarge your profit?
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EV Group (EVG)
is a world leader in wafer-processing solutions
for semiconductor, MEMS and nanotechnology applications.
Through its flexible manufacturing model, EVG develops
reliable, high-quality, low-cost-of-ownership systems that
are easily integrated into customer's fab lines. Key
products include wafer bonding, lithography/nanoimprint
lithography (NIL), metrology, photoresist coating, cleaning
and inspection equipment.
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There are no limits; only limiting thoughts
Innovation is dedication and superior competence
Reliability is the demand. Consistently high, trustworthy
performance is our response
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Triple i - the key to your success
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Solutions for the semiconductor and related microelectronics industries.
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